INDUSTRY PATH

Chiplets & 3D-IC

Integration, package, links, yield and qualification across composed silicon systems

AI + HPC

KONBIT-X1

A heterogeneous accelerator family that treats compute, state, optimization and fabric as collaborating parts of one machine.

Architecture IP

Connectivity

Multi-hop constrained graph routing with heterogeneous physical-link profiles and edge-disjoint backup planning.

Commercial software

Manufacturing

Package BOM/slot optimization, die non-reuse, grade/capability pairing, utilization and economics from customer-supplied values.

Commercial software

These are editorial starting points, not a claim that every selected product is qualified for every deployment in this industry.