Manufacturing
FabLoop
SPC/DOE analytics, confidence, control limits, Cp/Cpk when legitimate engineering limits exist, excursion detection and feedback evidence.
Commercial softwareProcess-aware engineering, release evidence, yield and manufacturing feedback
SPC/DOE analytics, confidence, control limits, Cp/Cpk when legitimate engineering limits exist, excursion detection and feedback evidence.
Commercial softwarePackage BOM/slot optimization, die non-reuse, grade/capability pairing, utilization and economics from customer-supplied values.
Commercial softwareThese are editorial starting points, not a claim that every selected product is qualified for every deployment in this industry.